发明名称 |
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE |
摘要 |
Disclosed is a method for fabricating a semiconductor device including: sequentially forming a first insulating film and a first barrier layer on a first surface of a substrate; etching the first barrier layer to form a first barrier layer pattern; etching the first insulating film to form a first insulating film pattern; removing the first barrier layer pattern and forming a first type epitaxial layer on an exposed first portion of the substrate; forming a second insulating film and a second barrier layer on the first type epitaxial layer and the first insulating film pattern; etching the second barrier layer to form a second barrier layer pattern; etching the second insulating film to form a second insulating film pattern, and etching the first insulating film pattern; and forming a second type epitaxial layer on an exposed second portion of the first surface of the n substrate. |
申请公布号 |
US2014187004(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
US201313830260 |
申请日期 |
2013.03.14 |
申请人 |
HYUNDAI MOTOR COMPANY |
发明人 |
Chun Dae Hwan;Lee Jong Seok;Hong Kyoung-Kook;Jung Youngkyun |
分类号 |
H01L29/66 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating a semiconductor device, the method comprising:
sequentially forming a first insulating film and a first barrier layer on a first surface of an n+ type substrate; etching the first barrier layer to form a first barrier layer pattern; etching the first insulating film by using the first barrier layer pattern as a mask to form a first insulating film pattern to thereby expose a first portion of a first surface of the n+ type silicon carbide substrate; removing the first barrier layer pattern and then forming a first type of epitaxial layer by a first epitaxial growth on the exposed first portion of the first surface of the n+ type silicon carbide substrate; sequentially forming a second insulating film and a second barrier layer on the first type of epitaxial layer and the first insulating film pattern; etching the second barrier layer to form a second barrier layer pattern; etching the second insulating film by using the second barrier layer pattern as a mask to form a second insulating film pattern, and etching the first insulating film pattern by using the second barrier layer pattern as a mask to expose a second portion of the first surface of the n+ type silicon carbide substrate; and forming a second type of epitaxial layer by a second epitaxial growth on the exposed second portion of the first surface of the n+ type silicon carbide substrate, wherein the first portion of the first surface of the n+ type silicon carbide substrate and the second portion of the first surface of the n+ type silicon carbide substrate are adjacent to each other. |
地址 |
Seoul KR |