| 主权项 |
1. A bonding apparatus for bonding a plurality of electrical dies, comprising:
a bottom plate that includes a first cavity, wherein the first cavity includes a first pocket configured to accommodate a Piezoelectric Micromachined Ultrasound Transducer (PMUT) die and a second pocket configured to accommodate an Application Specific Integrated Circuit (ASIC) die; a bonding plate configured to be positioned over and against the bottom plate, the bonding plate including a recess, wherein when the bonding plate is positioned against the bottom plate:
the PMUT die and the ASIC die would be trapped in a fixed position; and
the recess exposes a portion of the first pocket and a portion of the second pocket; a molding plate configured to be positioned over and against the bottom plate, wherein the molding plate includes:
a second cavity that is aligned with the first cavity when the molding plate is positioned against the bottom plate, such that the first and second cavities collectively define a shape of a transducer assembly;a first opening that is coupled to the second cavity, wherein the first opening exposes a portion of the first pocket when the molding plate is positioned against the bottom plate;a second opening that is coupled to the second cavity, wherein the second opening exposes a portion of the second pocket when the molding plate is positioned against the bottom plate; anda third opening that is in fluid communication with the first and second cavities such that a fluid can flow into the first and second cavities through the third opening. |
