发明名称 |
Thermal Barrier For Building Foundation Slab |
摘要 |
A thermal barrier for reducing heat transfer through the slab foundation of a building, said thermal barrier comprising: a substrate; a first attachment means disposed at the top of said substrate for attaching said thermal barrier to a building; an insulating sheathing attached to said substrate; a reflective layer disposed between said sheathing and said substrate; and a second attachment means for attaching said apparatus to a building, said second attachment means disposed adjacent to one side of said sheathing and against said substrate. |
申请公布号 |
US2014182221(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
US201313733188 |
申请日期 |
2013.01.03 |
申请人 |
Hicks Tony |
发明人 |
Hicks Tony |
分类号 |
E04B1/80;E02D31/00 |
主分类号 |
E04B1/80 |
代理机构 |
|
代理人 |
|
主权项 |
1. A thermal barrier for reducing heat loss through the slab foundation of a building, said thermal barrier comprising: a substrate; a means for attaching said substrate to a building; an insulating sheathing attached to said substrate; and a protective outer layer disposed against the exterior of the insulating sheathing. |
地址 |
Fort Wayne IN US |