发明名称 |
RESIN LAMINATE FOR MOLDING AND MOLDED ARTICLE |
摘要 |
<p>Provided is a resin laminate for molding that has excellent surface hardness and thermoformability and that is made by laminating at least two layers including a resin layer (A) formed of a thermoplastic resin composition (a) and a resin layer (B) formed of a curable resin composition (b), wherein the pencil hardness of the surface of the resin layer (B) is 5H or higher, and either: the storage modulus of the resin layer (A) and that of the resin layer (B) at a temperature 20°C below the glass transition temperature of the resin layer (A) satisfy the following relationship, -2.0 (GPa)≤Storage modulus of resin layer (B) - Storage modulus of resin layer (A)≤2.5 (GPa); or the stretch rate of said resin laminate for molding at a temperature 30°C below the glass transition temperature of the resin layer (A) is from 6% to 50% inclusive. Also provided is a molded article obtained by thermoforming said resin laminate for molding.</p> |
申请公布号 |
WO2014104334(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
WO2013JP85199 |
申请日期 |
2013.12.27 |
申请人 |
MITSUBISHI PLASTICS, INC. |
发明人 |
WATANABE, TAKAYUKI;KAWANO, MASAHIKO;SATO, NORIO |
分类号 |
B32B27/00;B29C51/08;B29C51/10;B29L9/00;B32B27/16 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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