发明名称 RESIN LAMINATE FOR MOLDING AND MOLDED ARTICLE
摘要 <p>Provided is a resin laminate for molding that has excellent surface hardness and thermoformability and that is made by laminating at least two layers including a resin layer (A) formed of a thermoplastic resin composition (a) and a resin layer (B) formed of a curable resin composition (b), wherein the pencil hardness of the surface of the resin layer (B) is 5H or higher, and either: the storage modulus of the resin layer (A) and that of the resin layer (B) at a temperature 20°C below the glass transition temperature of the resin layer (A) satisfy the following relationship, -2.0 (GPa)≤Storage modulus of resin layer (B) - Storage modulus of resin layer (A)≤2.5 (GPa); or the stretch rate of said resin laminate for molding at a temperature 30°C below the glass transition temperature of the resin layer (A) is from 6% to 50% inclusive. Also provided is a molded article obtained by thermoforming said resin laminate for molding.</p>
申请公布号 WO2014104334(A1) 申请公布日期 2014.07.03
申请号 WO2013JP85199 申请日期 2013.12.27
申请人 MITSUBISHI PLASTICS, INC. 发明人 WATANABE, TAKAYUKI;KAWANO, MASAHIKO;SATO, NORIO
分类号 B32B27/00;B29C51/08;B29C51/10;B29L9/00;B32B27/16 主分类号 B32B27/00
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