发明名称 BASKET JIG FOR ELECTROLESS PLATING AND PLATING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a basket jig for electroless plating and a plating method using the same.SOLUTION: A basket jig for electroless plating in accordance with the present invention comprises: a basket having a plurality of printed circuit boards loaded thereon; a rotating structure coupled to top portions of both sides of the basket; and a tube that is coupled to bottom portions of the basket and into which fluid is infused.
申请公布号 JP2014122420(A) 申请公布日期 2014.07.03
申请号 JP20130239758 申请日期 2013.11.20
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 NAM HYO SEUNG;YU CHANG SEOP;CHOI YUNN HONG
分类号 C23C18/31 主分类号 C23C18/31
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