| 发明名称 |
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
The present invention relates to a circuit board. A circuit board in accordance with an embodiment of the present invention includes a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction to surround the via structure and made of an insulating material. |
| 申请公布号 |
US2014182915(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314060345 |
申请日期 |
2013.10.22 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
HAN Sung;KWEON Young Do;KIM Jin Gu;JEON Hyung Jin;KIM Yoon Su |
| 分类号 |
H05K1/02;H05K3/00 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A circuit board comprising:
a base substrate; an interlayer insulating layer covering the base substrate; a via structure passing through at least the interlayer insulating layer of the base substrate and the interlayer insulating layer in the vertical direction; and an etch stop pattern disposed on the interlayer insulating layer in the horizontal direction perpendicular to the vertical direction to surround the via structure and made of an insulating material. |
| 地址 |
Suwon KR |
