| 发明名称 |
MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component. |
| 申请公布号 |
US2014182895(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314143527 |
申请日期 |
2013.12.30 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE Doo Hwan;KANG Ho Shik;SHIN Yee Na;CHUNG Yul Kyo;LEE Seung Eun |
| 分类号 |
H05K1/02;H05K3/30;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multilayered substrate comprising:
a plurality of wiring layers; and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate. |
| 地址 |
Suwon KR |
