| 摘要 |
<p>Figure la shows the chip (1), which has been introduced into the machine (not shown in the figure) and a heating or cooling subsystem composed of a temperature application element (2) connected to a metal block (3) in a flexible manner by means of springs (4). The temperature-adjusting subsystem is initially retracted, that is to say, it does not enter into contact with the chip (1) that is to be heated or cooled. After inserting the chip (figure 1a), the block (3) is displaced upwards and forces the temperature application element (2) into contact with the chip (figure lb). The block (3) continues ascending until it reaches the heating/cooling position of figure 1c. In this position, the temperature application element (2) is in contact with the chip (1) and the springs are compressed, with which the temperature application element (2) is being pressed against the chip with a certain force, thus ensuring a correct thermal contact.</p> |
