| 摘要 |
PROBLEM TO BE SOLVED: To provide techniques and configurations for an integrated circuit (IC) package with accurate component-to-component alignment.SOLUTION: Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having one or more dies connected to an integrated circuit board by an interface layer. In one embodiment, the interface layer may include an anisotropic portion configured to conduct electrical signals in an out-of-plane direction between one or more components, such as a die and an integrated circuit board. In another embodiment, the interface layer may include an anisotropic portion that serves as an interconnect between two components, a dielectric or insulating portion, and one or more interconnect structures that are surrounded by the dielectric or insulating portion and serve as interconnects between the same or other components. Other embodiments may be described and/or claimed. |
