| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a cooling apparatus for a stacked multistage electronic apparatus for achieving reduction in size and power consumption.SOLUTION: A cooling apparatus for a stacked multistage electronic apparatus comprises: a cooling air flow opening of each stage circuit board unit; a distribution introduction flow path that introduces a cooling air flow to each of the circuit board units, or a confluent introduction flow path that discharges the cooling air flow; and a cooling-air-flow-leak preventing packing provided between the cooling air flow opening of the circuit board units and the distribution introduction flow pass or the confluent introduction flow path. The opening of the circuit board units, an opening of the distribution introduction flow path, and an opening of the confluent introduction flow path are configured to be identical in size. The cooling air flow opening, the distribution introduction flow path, or the confluent introduction flow path, and the packing are connected to one another at the same position. A position of a surface on which a cooling fin of the circuit board units is attached, and an inner surface of the distribution introduction flow path or the confluent introduction flow path are connected to be substantially smooth having no difference in level.</p> |
