发明名称 COOLING FOR ELECTRONIC EQUIPMENT
摘要 An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed.
申请公布号 US2014185231(A1) 申请公布日期 2014.07.03
申请号 US201314140207 申请日期 2013.12.24
申请人 Lenovo (Singapore) Pte. Ltd. 发明人 Kamimura Takuroh;Chonan Tsutomu;Adachi Takateru;Tatsuno Kazuya;Akiyama Shogo
分类号 H05K7/20;G06F1/20;B23P19/00 主分类号 H05K7/20
代理机构 代理人
主权项 1. An electronic device, comprising: a housing with an exhaust port and an intake port; a heat source contained in said housing; a heat transfer unit connected to said heat source; a first radiator located adjacent to said exhaust port, wherein said first radiator is connected to said heat transfer unit; a first blower fan, wherein said first blower fan discharges heat transmitted to said first radiator; and a second radiator located adjacent to said intake port, wherein said second radiator is connected to said heat transfer unit.
地址 Singapore SG