发明名称 |
COOLING FOR ELECTRONIC EQUIPMENT |
摘要 |
An embodiment provides an electronic device, including: a housing with an exhaust port and an intake port; a heat source contained in the housing; a heat transfer unit connected to the heat source; a first radiator located adjacent to the exhaust port, wherein the first radiator is connected to the heat transfer unit; a first blower fan, wherein the first blower fan discharges heat transmitted to the first radiator; and a second radiator located adjacent to the intake port, wherein the second radiator is connected to the heat transfer unit. Other embodiments are described and claimed. |
申请公布号 |
US2014185231(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
US201314140207 |
申请日期 |
2013.12.24 |
申请人 |
Lenovo (Singapore) Pte. Ltd. |
发明人 |
Kamimura Takuroh;Chonan Tsutomu;Adachi Takateru;Tatsuno Kazuya;Akiyama Shogo |
分类号 |
H05K7/20;G06F1/20;B23P19/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic device, comprising:
a housing with an exhaust port and an intake port; a heat source contained in said housing; a heat transfer unit connected to said heat source; a first radiator located adjacent to said exhaust port, wherein said first radiator is connected to said heat transfer unit; a first blower fan, wherein said first blower fan discharges heat transmitted to said first radiator; and a second radiator located adjacent to said intake port, wherein said second radiator is connected to said heat transfer unit. |
地址 |
Singapore SG |