SLURRY COMPOSITION AND SUBSTRATE OR WAFER POLISHING METHOD USING THE SAME

摘要

The present invention relates to a slurry composition and a method for polishing a substrate or a wafer using the same. The slurry composition of the present invention can realize high selection ratio of polishing a poly film in comparison to an oxide film, not allow flocculation of polishing particles by maintaining high dispersing stability, reduce micro-scratch generation using a slurry composition containing polishing particles prepared by a liquid method, increase the speed of polishing an oxide film, and have the high selection ratio of a poly film. The slurry composition of the present invention can also maintain dispersing stability for mixing with a polishing addictive in a neutral range of pH. Thus, the slurry composition of the present invention can be used in a polishing process that is suitable for a process for preparing semiconductors.