发明名称 CIRCUIT BOARD MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit board manufacturing method which prevents poor insulation caused by deposition of unnecessary plating by a simple method.SOLUTION: A circuit board manufacturing method comprises: a process of performing a modification treatment on a surface of an insulating base material 1 to form a modified layer 2; a process of applying a plating catalyst 3 on the surface of the insulating base material 1 on which the modified layer 2 is formed; a process of pressing to the surface of the insulating base material 1 to which the plating catalyst 3 is applied, a roller-like member 4 or a plate-like member 14 which have adhesiveness on surfaces of respective salients 4a, 14a corresponding to regions where a circuit pattern is not to be formed and subsequently removing the roller-like member 4 or the pate-like member 14 from the surface of the insulating base material 1 thereby to remove the plating catalyst 3 from regions of the surface of the insulating base material 1, where the circuit pattern is not to be formed; and a process of performing electroless plating on a region of the surface of the insulating base material 1, where the plating catalyst 3 is applied to form the circuit pattern.</p>
申请公布号 JP2014123602(A) 申请公布日期 2014.07.03
申请号 JP20120277907 申请日期 2012.12.20
申请人 FUJIKURA LTD 发明人 FUJIMOTO TAKUYA
分类号 H05K3/18 主分类号 H05K3/18
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