DETECTING TSV DEFECTS IN 3D PACKAGING

摘要

A computer determines a threshold signal voltage of a semiconductor device. The computer determines a first expected signal propagation time for a signal travelling through a first test path of the semiconductor device. The computer transmits a first signal through the first test path. The computer measures a signal voltage and signal propagation time of the first signal. The computer determines that the signal voltage of the first signal does not reach or exceed the threshold signal voltage within the first expected signal propagation time. The computer determines that the first test path contains a defect.

主权项

1. A method for detecting defects in through silicon vias (TSVs) of a semiconductor device, comprising the steps of:
a computer determining a threshold signal voltage of a semiconductor device; the computer determining a first expected signal propagation time for a signal travelling through a first test path of the semiconductor device; the computer transmitting a first signal through the first test path; the computer measuring a signal voltage and a signal propagation time of the first signal; the computer determining that the signal voltage of the first signal does not reach or exceed the threshold signal voltage within the first expected signal propagation time; and the computer determining that the first test path contains a defect.