| 摘要 |
The present invention provides an anti-adhesion transparent thin film, which uses physical vapor deposition to deposit a transparent thin film on the surface of a substrate. The transparent film has the characteristics of high light perviousness, good hardness, excellent acid resistivity, and superior anti-adhesion capability. Furthermore, an oxide layer can be formed between the surface of the substrate and the transparent thin film for improving the stability of the transparent thin film adhering to the surface of the substrate. In addition, the process temperature according to the present invention is less than 100; and the transparent thin film according to the present invention requires no metal- or fluorine-containing precursor. Thereby, the costs for industrial applications can be reduced substantially. It is also suitable for the substrates with less temperature tolerance such as metal, nonmetal, and polymer-like substrates. Hence, the applicable industries are extensive. |
