PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND CHIP PACKAGING STRUCTURE HAVING SAME

摘要

A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.

主权项

1. A packaging substrate comprising:
a circuit board comprising a first base and a first conductive pattern layer formed on a first surface of the first base; a plurality of first conductive posts extending from and electrically connected to the first conductive pattern layer; and a plurality of second conductive posts extending from and electrically connected to the first conductive pattern layer, the height of each of the second conductive posts being larger than that of each of the first conductive posts.