发明名称 |
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME |
摘要 |
The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290°C to 420°C to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved. |
申请公布号 |
WO2014104860(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
WO2013KR12410 |
申请日期 |
2013.12.31 |
申请人 |
AMOGREENTECH CO., LTD. |
发明人 |
KIM, JONG-SOO;LEE, KYUNG-HOON;YU, JEONG-SANG;KWON, O-CHUNG |
分类号 |
H05K1/02;H05K3/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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