发明名称 DICING-SHEET SUBSTRATE FILM AND DICING SHEET
摘要 A dicing-sheet substrate film (2) equipped with a resin layer (A), wherein: the resin layer (A) contains a polyethylene (a1) having a density of 0.900g/cm3 or higher, and a styrene elastomer (a2); and the amount of the polyethylene (a1) contained represents 50-90 mass%, inclusive, of the total resin component contained in the resin layer (A), while the amount of the styrene elastomer (a2) contained represents 10-50 mass%, inclusive, of the total resin component contained in the resin layer (A). The dicing-sheet substrate film (2) does not require imparting physical energy such as electron rays or γ-rays thereto, suppresses the production of dicing scraps produced when dicing the article to be cut, and has sufficient expandability during the expansion step.
申请公布号 WO2014103468(A1) 申请公布日期 2014.07.03
申请号 WO2013JP77503 申请日期 2013.10.09
申请人 LINTEC CORPORATION 发明人 TAYA NAOKI;UEDA MASASHI;ITO MASAHARU
分类号 H01L21/301 主分类号 H01L21/301
代理机构 代理人
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