| 摘要 |
<p>A flip-chip LED chip comprises: a substrate (10), and a positive electrode (51), a negative electrode (71), and an isolation region (61) which are sequentially arranged on a front surface of the substrate (10) in a horizontal direction, wherein the horizontal direction is a direction parallel with the front surface of the substrate (10). A vertical projection of the isolation region (61) on the front surface of the substrate (10) is located between vertical projections of the positive electrode (51) and the negative electrode (71) on the front surface of the substrate (10). A central line of the isolation region (61) in the horizontal direction overlaps with a central axis (A) of the flip-chip LED chip in the horizontal direction, and a width (L2) of the isolation region (61) in the horizontal direction does not exceed one third of a width (L1) of the flip-chip LED chip in the horizontal direction. The isolation region of the flip-chip LED chip has a suitable width; therefore, the positive electrode is isolated from the negative electrode, and meanwhile, a high light-emitting effect can be obtained and electrical conduction of the positive electrode and the negative electrode caused by high temperature or other reasons during a chip packaging process can be effectively avoided.</p> |
