| 摘要 |
<p>The present invention relates to a high heat-dissipation printed circuit board and a method for manufacturing the same, the circuit board comprising: a heat-dissipation layer comprising carbon fiber fabrics; an insulation layer formed on the heat-dissipation layer; a wiring layer formed on the insulation layer and patterned by a printing method of a conductive paste composite; and a metal plating layer formed on the patterned wiring layer. Since the high heat-dissipation printed circuit board, according to the present invention, can have relatively improved heat-dissipation, light-weightness and flexibility characteristics, the high heat-dissipation printed circuit board can be applied to an LED heat-dissipation flexible module.</p> |
