| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid curable resin composition that is excellent in various physical properties such as heat resistance, and also that can be present as a liquid at room temperature even without substantially containing volatile components, such as an organic solvent or a diluent, and has a high fluidity, and to provide a sealing material and a semiconductor device employing the same.SOLUTION: A liquid curable resin composition comprises cyanate ester resin, inorganic filler and a basic compound, and is liquid. |
