发明名称 WYNN-DYSON IMAGING SYSTEM REDUCING THERMAL DEFORMATION
摘要 PROBLEM TO BE SOLVED: To provide a Wynn-Dyson imaging system reducing thermal deformation.SOLUTION: A reticle prism and a wafer prism are made of a glass material having a thermal expansion coefficient of about 100 ppb/°C or less. A Wynn-Dyson imaging system comprises: a first window arranged between a reticle 16 and a reticle prism 110R; and a second window arranged between a wafer 18 and a wafer prism, and maintaining symmetry of an image. The first window substantially blocks arrival of convective heat and radiation heat at the reticle prism, thus reducing the amount of thermally-induced image deformation of a reticle image formed on the wafer.
申请公布号 JP2014123719(A) 申请公布日期 2014.07.03
申请号 JP20130239824 申请日期 2013.11.20
申请人 ULTRATECH INC 发明人 HAWRYLUK M ANDREW
分类号 H01L21/027;G02B5/04;G02B17/08;G03F7/20 主分类号 H01L21/027
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