POWER MODULE FOR AUTOMOBILE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device requiring high heat resistance, in particular, to provide the semiconductor device used for an on-vehicle AC generator, and for connecting a connection member for the semiconductor device by using Pb-free solder for reduction in an environmental load of the connection member for the semiconductor device where occurrence of voids through interfacial reactions and a problem of connection defect can be avoided even when used at high temperature.SOLUTION: A semiconductor device having heat resistance of 200°C or more is realized by suppressing interfacial reactions by combining Ni-based plating 11 with Sn-based solder 17 containing a Cu6Sn5 phase at room temperature to 200°C as a connection method with the heat resistance of 200°C.