PRINTED CIRCUIT BOARD HAVING COPPER PLATED LAYER WITH ROUGHNESS AND METHOD OF MANUFACTURING THE SAME

摘要

Disclosed herein are a printed circuit board having a copper plated layer with an anchor shaped surface and roughness by forming the copper plated layer having an anisotropic crystalline orientation structure using a plating inhibitor at the time of forming the copper plated layer serving as a circuit wiring and using composite gas plasma and a dilute acid solution, and a method of manufacturing the same.

主权项

1. A printed circuit board comprising:
a board; a copper foil layer formed on the board; and a copper plated layer formed on the copper foil layer and having an anisotropic crystalline orientation structure.