SUBSTRATE CLEANING APPARATUS

摘要

A substrate cleaning apparatus cleans a surface of a substrate in a non-contact state. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold and rotate the substrate, a two-fluid nozzle configured to jet a two-fluid jet flow, comprising a gas and a liquid, downwardly toward the front surface of the substrate held by the substrate holding mechanism, and a moving mechanism configured to move the two-fluid nozzle in one direction from a central portion toward a radially outer side of the substrate held by the substrate holding mechanism. The two-fluid nozzle is inclined so that an angle between an ejection center line of the two-fluid jet flow jetted from the two-fluid nozzle and a vertical line becomes a certain inclined angle, and the two-fluid jet flow collides with the front surface of the substrate at a forward position in a moving direction of the two-fluid nozzle.

主权项

1. A substrate cleaning apparatus for cleaning a substrate having a front surface and a reverse surface, said substrate cleaning apparatus comprising:
a substrate holding mechanism configured to hold and rotate the substrate, with the front surface facing upward; a two-fluid nozzle configured to jet a two-fluid jet flow, comprising a gas and a liquid, downwardly toward the front surface of the substrate held by said substrate holding mechanism; and a moving mechanism configured to move said two-fluid nozzle in one direction from a central portion toward a radially outer side of the substrate held by said substrate holding mechanism; wherein said two-fluid nozzle is arranged to be inclined so that an angle between an ejection center line of the two-fluid jet flow jetted from said two-fluid nozzle and a vertical line becomes an inclined angle α, and the two-fluid jet flow collides with the front surface of the substrate at a forward position in a moving direction of said two-fluid nozzle.