| 发明名称 |
LIQUID PROCESSING APPARATUS |
| 摘要 |
A liquid processing apparatus and a chemical liquid collecting method can suppress corrosion of wirings formed on a substrate. The liquid processing apparatus includes a processing unit configured to perform a liquid process by supplying a chemical liquid to a substrate; a collecting line configured to collect the chemical liquid supplied to the processing unit; a supply line configured to supply the collected chemical liquid to the processing unit; and a gas supply unit configured to supply an inert gas into the collecting line. |
| 申请公布号 |
US2014182455(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314141605 |
申请日期 |
2013.12.27 |
| 申请人 |
Tokyo Electron Limited |
发明人 |
Mizota Shogo;Yabuta Takashi;Nagamatsu Tatsuya;Saiki Daisuke |
| 分类号 |
B01D19/00 |
主分类号 |
B01D19/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A liquid processing apparatus comprising:
at least one processing unit configured to perform a liquid process by supplying a chemical liquid to a substrate; a collecting line configured to collect the chemical liquid supplied to the at least one processing unit; a supply line configured to supply the collected chemical liquid to the at least one processing unit; and a gas supply unit configured to supply an inert gas into the collecting line. |
| 地址 |
Tokyo JP |
