| 摘要 |
PROBLEM TO BE SOLVED: To provide means for highly accurately forming a film of predetermined thickness in deposition that relatively moves an evaporation source with respect to a base material.SOLUTION: A vapor deposition device 1 is used, which comprises: an evaporation source 10 having an emission port 11 for a vapor deposition material; a vapor deposition chamber 20 accommodating the evaporation source 10 and a base material 5 and forming a reduced pressure state; evaporation source moving means 30 supporting the evaporation source 10 such that the emission port 11 faces the base material 5, and configured to reciprocally move the evaporation source 10; first vapor deposition speed measuring means 41 configured to measure the vapor deposition speed of a vapor deposition material in the initiation position of reciprocal movement; second vapor deposition speed measuring means 42 configured to measure the vapor deposition speed of a vapor deposition material in the middle position in reciprocal movement; and a vapor deposition quantity control part 50 connected to the evaporation source moving means 30, first vapor deposition speed measuring means 41 and second vapor deposition speed measuring means 42. |
