| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus for depositing a metal film, capable of depositing a metal film of uniform thickness without masking, and to provide a deposition method therefor.SOLUTION: A deposition apparatus 1A includes at least an anode 11, a cathode 12, a solid electrolyte membrane 13 disposed on a surface of the anode 11, and a power supply unit 14 for applying a voltage between the anode 11 and the cathode 12. The voltage is applied between the anode 11 and the cathode 12 to deposit metal ions contained in the solid electrolyte membrane 13 on the cathode side, thereby depositing a metal film F made of a metal of the metal ions. The anode 11 is formed of a porous body in which pores are formed so as to allow transmission of a solution L containing the metal ions therethrough and to supply the metal ions to the solid electrolyte membrane 13. The thickness of the solid electrolyte membrane 13 is in the range of 100-200μm.</p> |
