| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a printed circuit board allowing improvement in reliability and process simplicity, and a method of manufacturing the printed circuit board.SOLUTION: Disclosed herein is a printed circuit board, including: a base substrate 100; a non-photosensitive insulating layer 300 formed on the base substrate 100; a circuit pattern 200 formed on the base substrate 100 and having an upper portion protruded from an upper portion of the non-photosensitive insulating layer 300; and a dam 400 made of a photosensitive material and formed on the upper portion of the non-photosensitive insulating layer 300 of an outer side of the base substrate 100.</p> |
