| 发明名称 |
DISPLAY DEVICE BEING POSSIBLE TO DETECT BONDING DEFECT |
| 摘要 |
A bonding-defect-detectable display device is disclosed which includes: a display panel defined into an active area used to display images and a pad area in which pads is formed; driver IC (Integrated Circuit) chip loaded on a pad region of the display panel; a flexible printed circuit board mounted to the pad region of the display panel; and a bonding resistance detection unit disposed into the driver IC chip. The display panel includes: first and second bonding portions formed in an occupation region of the driver IC chip within the pad area of the display panel; and third and fourth bonding portions formed in an occupation region of the flexible printed circuit board with the pad area of the display panel. |
| 申请公布号 |
US2014187088(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201314011963 |
申请日期 |
2013.08.28 |
| 申请人 |
LG DISPLAY CO., LTD. |
发明人 |
KIM Bong Hwan;PARK Byung Hwee;KIM Yu Cheol |
| 分类号 |
H01R13/66 |
主分类号 |
H01R13/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A display device of being possible to detect a bonding defect, the display device comprising:
a display panel defined into an active area used to display images and a pad area in which pads is formed; driver IC (Integrated Circuit) chip loaded on a pad region of the display panel; a flexible printed circuit board mounted to the pad region of the display panel; and a bonding resistance detection unit disposed into the driver IC chip, wherein the display panel includes:
first and second bonding portions formed in an occupation region of the driver IC chip within the pad area of the display panel; andthird and fourth bonding portions formed in an occupation region of the flexible printed circuit board with the pad area of the display panel, and wherein the first through fourth bonding portions are electrically connected to one another, and the first and third bonding portions are connected to the bonding resistance detection unit. |
| 地址 |
Seoul KR |
