| 摘要 |
A semiconductor device (1) equipped with a circuit board (10) on which multiple connection pads (13) are formed, a first semiconductor chip (20) that is mounted on the circuit board (10), a second semiconductor chip (30) that is laminated on the first semiconductor chip (20) and has multiple electrodes (31), reinforcement plates (40) that are laminated on the second semiconductor chip (30), and multiple wires that electrically connect the multiple connection pads (13) and the multiple electrodes (31) together, wherein the second semiconductor chip (30) has a laminated area (32) that overlaps with the first semiconductor chip (20) and overhang areas (33) that overhang from the first semiconductor chip (20), the electrodes (31) are formed in the overhang areas (33), and the reinforcement plates (40) are laminated on the second semiconductor chip (30) so as to straddle the laminated area (32) and the respective overhang areas (33) of the second semiconductor chip (30). |
