发明名称 METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET, AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET
摘要 <p>This method for manufacturing a thermally conductive pressure-sensitive adhesive sheet includes the following steps: a step (I) in which a thermally conductive sheet that contains a fluorine resin and a thermally conductive filler is formed, said thermally conductive filler constituting 40% to 90% of the volume of the thermally conductive sheet; and a step (II) in which sputter etching is performed on one or both surfaces of the thermally conductive sheet and a pressure-sensitive adhesive layer or layers is/are then formed on the sputter-etched surface(s) of the thermally conductive sheet. This thermally conductive pressure-sensitive adhesive sheet contains the following: a thermally conductive sheet that contains a fluorine resin and a thermally conductive filler, said thermally conductive filler constituting 40% to 90% of the volume of the thermally conductive sheet; and a pressure-sensitive adhesive layer or layers provided on one or both surfaces of the thermally conductive sheet. Part of the thermally conductive filler is exposed across at least 50% of the surface area of the surface(s) of the thermally conductive sheet on which the pressure-sensitive adhesive layer(s) is/are provided.</p>
申请公布号 WO2014103328(A1) 申请公布日期 2014.07.03
申请号 WO2013JP07669 申请日期 2013.12.27
申请人 NITTO DENKO CORPORATION 发明人 FUJIWARA, KEIKO;TAKAYAMA, YOSHINARI;TAGAWA, KENICHI;KIGAMI, HIROKI
分类号 C09J7/02;B32B27/00;B32B27/30 主分类号 C09J7/02
代理机构 代理人
主权项
地址