发明名称 |
METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET, AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET |
摘要 |
<p>This method for manufacturing a thermally conductive pressure-sensitive adhesive sheet includes the following steps: a step (I) in which a thermally conductive sheet that contains a fluorine resin and a thermally conductive filler is formed, said thermally conductive filler constituting 40% to 90% of the volume of the thermally conductive sheet; and a step (II) in which sputter etching is performed on one or both surfaces of the thermally conductive sheet and a pressure-sensitive adhesive layer or layers is/are then formed on the sputter-etched surface(s) of the thermally conductive sheet. This thermally conductive pressure-sensitive adhesive sheet contains the following: a thermally conductive sheet that contains a fluorine resin and a thermally conductive filler, said thermally conductive filler constituting 40% to 90% of the volume of the thermally conductive sheet; and a pressure-sensitive adhesive layer or layers provided on one or both surfaces of the thermally conductive sheet. Part of the thermally conductive filler is exposed across at least 50% of the surface area of the surface(s) of the thermally conductive sheet on which the pressure-sensitive adhesive layer(s) is/are provided.</p> |
申请公布号 |
WO2014103328(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
WO2013JP07669 |
申请日期 |
2013.12.27 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
FUJIWARA, KEIKO;TAKAYAMA, YOSHINARI;TAGAWA, KENICHI;KIGAMI, HIROKI |
分类号 |
C09J7/02;B32B27/00;B32B27/30 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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