| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package having improved electrical characteristics.SOLUTION: A semiconductor package according to the present embodiment comprises a package substrate having an opening at the center and a circuit pattern adjacent to the opening; a first semiconductor chip which is arranged above the package substrate and has first bonding pads; a pair of second semiconductor chips which are mounted between the package substrate and the first semiconductor chip and has second bonding pads, respectively, and which are arranged at a distance from each other; and connection members for electrically connecting the first bonding pads with the second bonding pads, respectively. |
