| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a composite material which has sufficient rigidity and thermal conductivity as a component of a semiconductor manufacturing apparatus or the like, and can further extend a temperature range exhibiting a low thermal expansion property, and to provide a method for manufacturing the same.SOLUTION: A metal-ceramic composite material according to a first mode of the present invention is combined with a base material formed of Al or an Al alloy, ZWP and SiC. A filling rate of the ZWP and the SiC is included in a range of 75-81 vol.%, and a volume ratio of the SiC with respect to the ZWP is included in a range of 0.13-0.42.</p> |
