发明名称 Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Distension
摘要 Apparatus and processes for preparing heterostructures with reduced strain are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect heterostructure.
申请公布号 US2014187022(A1) 申请公布日期 2014.07.03
申请号 US201314142553 申请日期 2013.12.27
申请人 SunEdison, Inc. 发明人 Falster Robert J.;Voronkov Vladimir V.;Pitney John A.;Albrecht Peter D.
分类号 H01L21/322;H01L21/302 主分类号 H01L21/322
代理机构 代理人
主权项 1. A process for relaxing the strain in a heterostructure comprising a substrate, a surface layer disposed on the substrate and an interface between the substrate and the surface layer, the substrate comprising a central axis, a back surface which is generally perpendicular to the central axis, and a diameter extending across the substrate through the central axis, the process comprising: forming a dislocation source layer in the substrate; and radially distending the substrate to generate dislocations and glide the dislocations from the dislocation source layer toward the surface layer.
地址 St. Peters MO US