发明名称 |
Processes and Apparatus for Preparing Heterostructures with Reduced Strain by Radial Distension |
摘要 |
Apparatus and processes for preparing heterostructures with reduced strain are disclosed. The heterostructures may include a semiconductor structure that conforms to a surface layer having a different crystal lattice constant than the structure to form a relatively low-defect heterostructure. |
申请公布号 |
US2014187022(A1) |
申请公布日期 |
2014.07.03 |
申请号 |
US201314142553 |
申请日期 |
2013.12.27 |
申请人 |
SunEdison, Inc. |
发明人 |
Falster Robert J.;Voronkov Vladimir V.;Pitney John A.;Albrecht Peter D. |
分类号 |
H01L21/322;H01L21/302 |
主分类号 |
H01L21/322 |
代理机构 |
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代理人 |
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主权项 |
1. A process for relaxing the strain in a heterostructure comprising a substrate, a surface layer disposed on the substrate and an interface between the substrate and the surface layer, the substrate comprising a central axis, a back surface which is generally perpendicular to the central axis, and a diameter extending across the substrate through the central axis, the process comprising:
forming a dislocation source layer in the substrate; and radially distending the substrate to generate dislocations and glide the dislocations from the dislocation source layer toward the surface layer. |
地址 |
St. Peters MO US |