WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES

摘要

An apparatus for the wafer level packaging (WLP) of micro-bolometer vacuum package assemblies (VPAs), in one embodiment, includes a wafer alignment and bonding chamber, a bolometer wafer chuck and a lid wafer chuck disposed within the chamber in vertically facing opposition to each other, means for creating a first ultra-high vacuum (UHV) environment within the chamber, means for heating and cooling the bolometer wafer chuck and the lid wafer chuck independently of each other, means for moving the lid wafer chuck in the vertical direction and relative to the bolometer wafer chuck, means for moving the bolometer wafer chuck translationally in two orthogonal directions in a horizontal plane and rotationally about a vertical axis normal to the horizontal plane, and means for aligning a fiducial on a bolometer wafer held by the bolometer wafer chuck with a fiducial on a lid wafer held by the lid wafer chuck.

主权项

1. A method for the wafer level packaging (WLP) of microbolometer vacuum package assemblies (VPAs), the method comprising:
providing a bolometer wafer; providing a lid wafer; mounting the bolometer wafer on a bolometer wafer chuck using an ESC; mounting the lid wafer on a lid wafer chuck, using an ESC, and in facing opposition to the bolometer wafer; baking the bolometer wafer at a first temperature using the bolometer chuck; baking the lid wafer at a second temperature using the lid wafer chuck; raising the respective temperatures of the bolometer wafer and the lid wafer to a common bonding temperature using the bolometer and lid wafer chucks; clamping the bolometer wafer and the lid wafer together with a selected force, such that the wafers are bonded together in a bonded wafer pair; and lowering the temperature of the bonded wafer pair below the common bonding temperature, wherein the providing, mounting, baking, raising, clamping and lowering are effected in an ultra-high vacuum (UHV) environment.