SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMPERATURES

摘要

Disclosed systems and methods for testing a device under test (DUT) with a probe system are selected to test a DUT at a temperature below the dew point of the ambient environment surrounding the probe system. Probe systems include a measurement chamber configured to isolate a cool, dry testing environment and a measurement chamber door configured to selectively isolate the internal volume of the measurement chamber. When a DUT, that is or is included on a substrate, is tested at a low temperature, systems and methods are selected to heat the substrate in a dry environment, at least partially isolated from the measurement chamber, to at least a temperature above the dew point and/or the frost point of the ambient environment.

主权项

1. A probe system, comprising:
a measurement chamber that defines a measurement chamber internal volume; a chuck that is located within the measurement chamber internal volume; a measurement chamber temperature-control assembly that is configured to cool the chuck and a substrate within the measurement chamber internal volume to a temperature below a dew point temperature of an ambient environment surrounding the probe system; a measurement chamber purging assembly that is configured to direct a measurement chamber dry gas stream into the measurement chamber internal volume; an access chamber that defines an access chamber internal volume; a measurement chamber door that is configured to selectively isolate the measurement chamber internal volume from the access chamber internal volume; a transfer assembly that is configured to selectively transfer the substrate through the measurement chamber door and thus between the measurement chamber internal volume and the access chamber internal volume; and an access chamber purging assembly that is configured to selectively direct a heated access chamber dry gas stream in fluid contact with the substrate when the substrate is located within the access chamber internal volume.