| 发明名称 |
Light-Emitting Module Board and Manufacturing Method of the Light-Emitting Module Board |
| 摘要 |
A light-emitting module board includes a metal board provided with an insulating layer, a light-emitting part and a white insulating film. The light-emitting part includes plural LED chips mounted on the metal board, and a white reflecting film of a ceramic coating formed in a light-emitting area on the metal board on which the plural LED chips are mounted. The white insulating film is an insulating film made of a same material as the white reflecting film and formed in a non-light-emitting area which is other than the light-emitting part and is provided on the metal board outside the light-emitting part. |
| 申请公布号 |
US2014183565(A1) |
申请公布日期 |
2014.07.03 |
| 申请号 |
US201313795120 |
申请日期 |
2013.03.12 |
| 申请人 |
CORPORATION TOSHIBA LIGHTING & TECHNOLOGY |
发明人 |
UENO Kousuke;SHIBANO Nobuo;TAKAHARA Yuichiro;TAMAI Hiroki;HAMASAKI Hiroshi |
| 分类号 |
H01L33/60 |
主分类号 |
H01L33/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light-emitting module board comprising:
a board; a light-emitting part including a plurality of light-emitting components mounted on the board; a white reflecting film of a ceramic coating formed in a light-emitting area of the board and on which the plurality of light-emitting components are mounted; and a white insulating film made of a same material as the white reflecting film and formed in a non-light-emitting area of the board and outside the light-emitting part. |
| 地址 |
US |
