INSPECTION APPARATUS, INSPECTION METHOD, EXPOSURE SYSTEM, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD

摘要

In order to inspect each processing condition among a plurality of processing conditions with high accuracy using a substrate having a pattern processed under the plurality of processing conditions, an inspection apparatus (1) is provided with: a stage (5) which is able to hold a wafer (10) on which a pattern is formed under a plurality of exposure conditions; an illumination system (20) which illuminates the surface of the wafer (10) with polarized light; an image capturing device (35) and an image processing unit (40) which receive light emitted from the surface of the wafer (10), and detect a condition for prescribing the polarization state of the light; and a computing unit (50) which finds an apparatus condition for determining the exposure condition of the pattern on the basis of the condition for prescribing the polarization state of light emitted from a conditioned wafer (10a) on which a pattern is formed under a known exposure condition.