发明名称 SEMICONDUCTOR MODULE
摘要 A semiconductor module has a pair of semiconductor devices 16, 18 that are connected in series with each other and have first terminals 12, 14 electrically connected to a first power system BT and a second terminal 13 electrically connected to a second power system M, a heat sink 7, a first electrode 10 that is electrically connected both to the first terminal 12, that is one of the first terminals, and to one of electrodes of the semiconductor device 16, that is one of the pair of semiconductor devices, an output electrode 11 that is electrically connected both to the second terminal 13 and to one of electrodes of the semiconductor device 18, that is the other one of the pair of semiconductor devices, and a second electrode 9 that is electrically connected to the first terminal 14, that is the other one of the first terminals. The second electrode 9 is connected to the heat sink 7 via a first insulating member 8a, and the output electrode 11 is connected to the second electrode 9 via a second insulating member 8b.
申请公布号 EP2750184(A1) 申请公布日期 2014.07.02
申请号 EP20120825114 申请日期 2012.08.24
申请人 NISSAN MOTOR CO., LTD;FUJI ELECTRIC CO., LTD. 发明人 ZUSHI, YUSUKE;MURAKAMI, YOSHINORI;TANIMOTO, SATOSHI;MATSUI, KOHEI
分类号 H01L23/36;H01L25/07;H01L25/18 主分类号 H01L23/36
代理机构 代理人
主权项
地址