Credential manufacturing device substrate shuttle

摘要

One embodiment of a credential manufacturing device (100) comprises a first hopper (110), a first processing path (124), a first processing device (112), a substrate shuttle (120) and a shuttle drive (130). The first hopper (110) is configured to contain a plurality of card substrates (122) and includes an output port through which individual card substrates are discharged. The first processing device (112) is in the first processing path (124) and is configured to perform a first process on individual card substrates in the first processing path. The substrate shuttle (120) is positioned between the first hopper (110) and the first processing path (124) and is configured to move relative to the first hopper and the first processing path along a horizontal shuttle path (126) that is transverse to the first processing path. The shuttle (120) is configured to receive individual card substrates from the output port of the first hopper (110), transport received card substrates along the shuttle path (126), and deliver received card substrates to the first processing path (124). The shuttle drive (130) is configured to drive movement of the substrate shuttle (120) along the shuttle path (124).