| 摘要 |
A process of manufacturing an optical flexible circuit comprising: (a) disposing an adhesive layer on at least a portion of a carrier film, said adhesive layer having a downward adhesive face and an upward adhesive face, said downward adhesive face and said carrier film being configured such that said carrier film is removable from said downward adhesive face without disruption of said downward adhesive face; (b) routing one or more fibers on said upward adhesive layer; (c) coating said fibers to define an optical circuit; and (d) optionally parting said carrier film to separate said optical circuit from other optical circuits on said carrier film. |
