| 摘要 |
The present invention relates to an epoxy resin composition for sealing a semiconductor device including epoxy resin, a curing agent, an inorganic filler, and a colorant containing titanium oxide, iron oxide, and a mixture of mica and the semiconductor device manufactured using the epoxy resin composition. The present invention provides the epoxy resin composition for sealing the semiconductor device capable of implementing excellent marking properties to a carbon dioxide laser in which output is low, reducing the generation of soot during laser marking by reducing the content of carbon black which is an existing colorant, and increasing electric insulation. |
