EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PACKAGE USING THE SAME

摘要

The present invention relates to an epoxy resin composition for sealing a semiconductor device, which comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler and a dispersing agent; and to a semiconductor device sealed by using the same, wherein the epoxy resin comprises an epoxy resin expressed as chemical formula 1; the curing agent comprises a curing agent expressed as checmical formula 2; the curing accelerator comprises an imidazole-based curing accelerator; the dispersing agent comprises a dispersing agent having a phosphate ester bond.