发明名称 |
A METHOD OF ASSEMBLING VCSEL CHIPS ON A SUB-MOUNT |
摘要 |
The present invention relates to a method of assembling VCSEL chips (1) on a sub-mount (2). A de-wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub-mount (2). A further de-wetting layer (13) is deposited on a connecting side of the sub-mount (2) which is to be connected to the VCSEL chips (1). The de-wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub-mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub-mount (2) and soldered to the sub-mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub-mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub-mount (2) is achieved without time consuming measures. |
申请公布号 |
EP2748902(A2) |
申请公布日期 |
2014.07.02 |
申请号 |
EP20120795067 |
申请日期 |
2012.10.08 |
申请人 |
KONINKLIJKE PHILIPS N.V.;PHILIPS DEUTSCHLAND GMBH |
发明人 |
PRUIJMBOOM, ARMAND;DUMOULIN, RAIMOND, LOUIS;MILLER, MICHAEL |
分类号 |
H01S5/022;H01S5/183;H01S5/42 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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