发明名称 |
Temperature compensated micro-electromechanical device and method of temperature compensation in a micro-electromechanical device |
摘要 |
<p>A micro-electromechanical device includes a semiconductor body (5), in which at least one first microstructure (2) and one second microstructure (3) of reference are integrated. The first microstructure (2) and the second microstructure (3) are arranged in the body (5) so as to undergo equal strains as a result of thermal expansions of said body (5; 105; 205; 305). Furthermore, the first microstructure (2) is provided with movable parts (6) and fixed parts (7) with respect to the body (5), and the second microstructure (3) has a shape that is substantially symmetrical to the first microstructure (2) and is fixed with respect to the body (5).</p> |
申请公布号 |
EP1645847(B1) |
申请公布日期 |
2014.07.02 |
申请号 |
EP20040425753 |
申请日期 |
2004.10.08 |
申请人 |
STMICROELECTRONICS SRL |
发明人 |
LASALANDRA, ERNESTO;MERASSI, ANGELO;ZERBINI, SARAH |
分类号 |
G01C19/56;B81B3/00;B81B7/00;G01C19/5755;G01P1/00;G01P15/125;G01P15/18;H01L23/34;H03H9/02 |
主分类号 |
G01C19/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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