| 摘要 |
<p>Dies from a wafer are reassembled with passive components and encapsulated to form a reconstituted electronic device 10 comprising a die 11, a passive, functioning component 13 and a metallic redistribution layer 15 which defines an electronic component in an area at least partially above the functioning material. The electronic component may be a metal-oxide-metal capacitor, an inductor or an antenna. The functioning material may be ceramic or it may be a ferrite. The functioning material may surround the die. In one embodiment the functioning material is a ceramic body with a metallic coating 110 (figure 10) on a face opposite that of the surface of the substrate on which the die and functioning material are embedded, a metallic via 102 (figure 9) is included through the ceramic body to contact the metal coating, the redistribution layer/ceramic body/metal coating structure forms a capacitor. In another embodiment the functioning material may be a metal carrier 120 (figure 11) with an insulating coating 121 (figure 11) and the die 126 (figure 11) placed on the insulating coating. Optionally the metal redistribution layer may be connected to the metallic via.</p> |
