INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY, PRODUCING METHOD THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

The present invention provides an insulating film for a printed circuit board with excellent thermal conductivity, a method for producing the same, and a printed circuit board applied with the insulating film. The insulating film of the present invention includes an amphiprotic block copolymer in which a hydrophilic compound and a hydrophobic compound are chemically bonded and formed in a vertical structure in a thickness direction.