| 摘要 |
The present invention provides an apparatus for monitoring a plating line which can measure a state of a rectifier, installed on an electrolyte plating apparatus, in real time. The apparatus for monitoring a plate line includes: a plurality of plating baths in which a plating solution is filled; a plurality of rectifiers of which both ends are electrically connected with an object contained in the plating bath and the plating solution, independently, to provide direct current voltages; a plurality of sensors which measure a state value of the rectifiers; a value processing part, which compares the value measured by the sensor part with a predetermined range to judge whether the value is normal or not; a PLC shelf which receives the state value measured by the sensor part and transmits the state value to the value processing part; and a plurality of data converters which receive the state value measured by the sensor part, convert the state value, and transmit the state value to the value processing part. |
