发明名称 THIN FILM ENCAPSULATION MANUFACTURING DEVICE AND MANUFACTURING METHOD OF THIN FILM ENCAPSULATION
摘要 Disclosed are a thin film encapsulation manufacturing device and a thin film encapsulation manufacturing method. The present invention includes a first cluster which forms a first inorganic layer by performing a sputtering process on a display substrate, and a second cluster which forms a first organic layer by performing a monomer deposition process on the first inorganic layer transferred from the first cluster, and a third cluster which forms a second inorganic layer by performing a chemical deposition process or plasma chemical vapor deposition process on the first organic layer transferred from the second cluster.
申请公布号 KR20140082479(A) 申请公布日期 2014.07.02
申请号 KR20120152501 申请日期 2012.12.24
申请人 SAMSUNG DISPLAY CO., LTD. 发明人 HUH, MYUNG SOO;YI, JEONG HO;LEE, YONG SUK
分类号 H01L21/205;H01L21/203 主分类号 H01L21/205
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